Pages that link to "Item:Q1870746"

The following pages link to Analysis of microchannel heat sinks for electronics cooling (Q1870746):

Displaying 7 items.

• The heat transfer characteristics of liquid cooling heatsink containing microchannels (Q621106) (← links)
• Numerical study of conjugated heat transfer in metal foam filled double-pipe (Q709042) (← links)
• A compute-bound formulation of Galerkin model reduction for linear time-invariant dynamical systems (Q2237473) (← links)
• Modeling and simulation on the mass flow distribution in microchannel heat sinks with non-uniform heat flux conditions (Q2379479) (← links)
• Microscopic and macroscopic approach for natural convection in enclosures filled with fluid saturated porous medium (Q4467616) (← links)
• Analysis and optimization of the thermal performance of microchannel heat sinks (Q5493078) (← links)
• Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme (Q5493085) (← links)