A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis (Q3176035): Difference between revisions

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Latest revision as of 03:34, 20 March 2024

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A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis
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    A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis (English)
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    18 July 2018
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    heat conduction problem
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    numerical simulation computation
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    mixed finite element
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    modified upwind fractional step difference
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    second-order error estimates
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