Interface delamination of bi-material structure under time harmonic load. Cohesive behaviour of the interface (Q3107334): Difference between revisions

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+https://doi.org/10.1002/zamm.201000210
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+W2097564813
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+Two bonded half planes with a crack going through the interface
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+Mixed Mode Cracking in Layered Materials
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+Local elastodynamic stresses in the unit cell of a woven fabric composite
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+A Continuum Model for Void Nucleation by Inclusion Debonding
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+The relation between crack growth resistance and fracture process parameters in elastic-plastic solids
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+Interface delamination of bi-material structure under dynamic time harmonic loading
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