Mode-I crack problem for functionally graded layered structures (Q2439552): Difference between revisions

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-Sheng-Hu Ding
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+Sheng-Hu Ding
@@ Property / author: Sheng-Hu Ding / rank @@
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+MaRDI publication profile
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@@ Property / full work available at URL @@
+https://doi.org/10.1007/s10704-010-9575-5
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+W2020781693
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@@ Property / cites work @@
+Determination of thermal stress intensity factors for an interface crack in a graded orthotropic coating-substrate structure
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+Stress intensity factors for an oblique edge crack in a coating/substrate system with a graded interfacial zone under antiplane shear
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+Thermoelastic contact mechanics for a flat punch sliding over a graded coating/substrate system with frictional heat generation
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+Stresses in bonded materials with a crack perpendicular to the interface
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+A Surface Crack in a Graded Medium Under General Loading Conditions
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+The Crack Problem for a Nonhomogeneous Plane
@@ Property / cites work: The Crack Problem for a Nonhomogeneous Plane / rank @@
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+The Crack Problem for Bonded Nonhomogeneous Materials Under Antiplane Shear Loading
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+The Mode III Crack Problem in Bonded Materials With a Nonhomogeneous Interfacial Zone
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+The Surface Crack Problem for a Plate With Functionally Graded Properties
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+Fracture analysis of a functionally graded coating-substrate structure with a crack perpendicular to the interface. I: Static problem
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+Mode I crack problem for a functionally graded orthotropic strip
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+An anti-plane crack perpendicular to the weak/micro-discontinuous interface in a bi-FGM structure with exponential and linear non-homogeneities
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+The numerical solution of non-singular linear integral equations
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+Investigation of the dynamic behavior of a finite crack in the functionally graded materials by use of the Schmidt method
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