Electro-mechanical frictionless contact behavior of a functionally graded piezoelectric layered half-plane under a rigid punch (Q837322): Difference between revisions
From MaRDI portal
Normalize DOI. |
Normalize DOI. |
||
| Property / DOI | |||
| Property / DOI: 10.1016/J.IJSOLSTR.2008.01.028 / rank | |||
| Property / DOI | |||
| Property / DOI: 10.1016/J.IJSOLSTR.2008.01.028 / rank | |||
Normal rank | |||
Latest revision as of 04:42, 10 December 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Electro-mechanical frictionless contact behavior of a functionally graded piezoelectric layered half-plane under a rigid punch |
scientific article |
Statements
Electro-mechanical frictionless contact behavior of a functionally graded piezoelectric layered half-plane under a rigid punch (English)
0 references
10 September 2009
0 references
contact mechanics
0 references
functionally graded piezoelectric materials
0 references
frictionless
0 references
conducting punch
0 references
singular integral equation
0 references
0 references
0 references
0 references
0 references
0 references
