Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (Q416551): Difference between revisions

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Property / DOI: 10.1016/j.compfluid.2007.07.007 / rank
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Property / MaRDI profile type: Publication / rank
 
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Property / full work available at URL: https://doi.org/10.1016/j.compfluid.2007.07.007 / rank
 
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Property / OpenAlex ID: W2034871612 / rank
 
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Property / cites work: Upwind differencing scheme for the time-accurate incompressible Navier-Stokes equations / rank
 
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Property / cites work: A level set approach for computing solutions to incompressible two-phase flow / rank
 
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Property / cites work: A continuum method for modeling surface tension / rank
 
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Property / cites work: Numerical Analysis of Particle Behavior Penetrating into Liquid by Level Set Method / rank
 
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Property / DOI: 10.1016/J.COMPFLUID.2007.07.007 / rank
 
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Latest revision as of 16:55, 9 December 2024

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Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
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