A simulation study of new multi-objective composite dispatching rules, CONWIP, and push lot release in semiconductor fabrication (Q3518468): Difference between revisions

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Property / full work available at URL: https://doi.org/10.1080/00207540600711879 / rank
 
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Property / OpenAlex ID: W2021185264 / rank
 
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Latest revision as of 13:20, 28 June 2024

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A simulation study of new multi-objective composite dispatching rules, CONWIP, and push lot release in semiconductor fabrication
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