Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging (Q1566558): Difference between revisions
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Latest revision as of 11:46, 25 June 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging |
scientific article |
Statements
Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging (English)
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26 November 2000
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flow
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conjugate heat transfer
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microchannel-based heat sink
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electronic packaging
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incompressible laminar Navier-Stokes equations
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thermal resistance
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friction coefficient
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Reynolds numbers
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temperature and heat flux distributions
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average heat transfer characteristics
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convection-conduction
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