Analysis of a rotating FGMEE circular disk with variable thickness under thermal environment (Q2290185): Difference between revisions

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+https://doi.org/10.1016/j.apm.2017.01.007
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+W2577937836
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+Analysis of functionally graded rotating disks with variable thickness
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+Stresses distributions in a rotating functionally graded piezoelectric hollow cylinder
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+Application and analysis of functionally graded piezoelectrical rotating cylinder as mechanical sensor subjected to pressure and thermal loads
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+Statics of FGM circular plate with magneto-electro-elastic coupling: axisymmetric solutions and their relations with those for corresponding rectangular beam
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+Analytical solution of multiple moving cracks in functionally graded piezoelectric strip
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+A power series solution for vibration and complex modal stress analyses of variable thickness viscoelastic two-directional FGM circular plates on elastic foundations
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+Analysis of two-dimensional functionally graded rotating thick disks with variable thickness
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+Free vibration of a FGPM circular plate placed in a uniform magnetic field
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+Thermo-elastic analysis of a functionally graded rotating hollow circular disk with variable thickness and angular speed
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+Q3706656
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+Q5848416
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+Stress analysis of functionally graded rotating discs: analytical and numerical solutions
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+Micromechanical modeling of piezo-magneto-thermo-elastic composite structures. Part II: Applications
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+Publication:2290185