Interface delamination of bi-material structure under time harmonic load. Cohesive behaviour of the interface (Q3107334): Difference between revisions

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Property / cites work: Two bonded half planes with a crack going through the interface / rank
 
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Property / cites work: Mixed Mode Cracking in Layered Materials / rank
 
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Property / cites work: A Continuum Model for Void Nucleation by Inclusion Debonding / rank
 
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Property / cites work: The relation between crack growth resistance and fracture process parameters in elastic-plastic solids / rank
 
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Property / cites work: Interface delamination of bi-material structure under dynamic time harmonic loading / rank
 
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Latest revision as of 19:24, 4 July 2024

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Interface delamination of bi-material structure under time harmonic load. Cohesive behaviour of the interface
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