Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors (Q1788375): Difference between revisions
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Revision as of 20:42, 12 February 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors |
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Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors (English)
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8 October 2018
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thermal piezoelectric semiconductor
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penny-shaped crack
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fundamental solutions
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extended displacement discontinuity boundary element method
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intensity factor
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