Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405): Difference between revisions
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Revision as of 12:00, 10 February 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Electromigration of intergranular voids in metal films for microelectronic interconnects. |
scientific article |
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Electromigration of intergranular voids in metal films for microelectronic interconnects. (English)
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20 May 2003
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finite difference scheme
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Runge-Kutta integration scheme
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static Laplace equation
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