Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016): Difference between revisions
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Revision as of 00:04, 5 March 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction |
scientific article |
Statements
Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (English)
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20 August 2013
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smart-cut technology
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silicon-on-insulator wafer
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crack growth
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fracture mechanics
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stress intensity factor
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