A 3-D thermoelastic analysis of the buckling of a layer bonded to a compliant substrate and related problems (Q1959988): Difference between revisions

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A 3-D thermoelastic analysis of the buckling of a layer bonded to a compliant substrate and related problems
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    A 3-D thermoelastic analysis of the buckling of a layer bonded to a compliant substrate and related problems (English)
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    12 October 2010
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    buckling-wave propagation analogy
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    combined stresses
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    layered composites
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    microbuckling
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    orthotropic layer
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    stiff film
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    wrinkling
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