Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405): Difference between revisions
From MaRDI portal
Changed an Item |
Set profile property. |
||
| Property / MaRDI profile type | |||
| Property / MaRDI profile type: MaRDI publication profile / rank | |||
Normal rank | |||
Revision as of 06:01, 5 March 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Electromigration of intergranular voids in metal films for microelectronic interconnects. |
scientific article |
Statements
Electromigration of intergranular voids in metal films for microelectronic interconnects. (English)
0 references
20 May 2003
0 references
finite difference scheme
0 references
Runge-Kutta integration scheme
0 references
static Laplace equation
0 references
