A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis (Q3176035): Difference between revisions
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Revision as of 11:02, 5 March 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis |
scientific article |
Statements
A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis (English)
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18 July 2018
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heat conduction problem
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numerical simulation computation
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mixed finite element
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modified upwind fractional step difference
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second-order error estimates
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