Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016): Difference between revisions
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| Property / Mathematics Subject Classification ID: 74R10 / rank | |||
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| Property / Mathematics Subject Classification ID: 74G70 / rank | |||
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| Property / zbMATH DE Number: 6199542 / rank | |||
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smart-cut technology | |||
| Property / zbMATH Keywords: smart-cut technology / rank | |||
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silicon-on-insulator wafer | |||
| Property / zbMATH Keywords: silicon-on-insulator wafer / rank | |||
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crack growth | |||
| Property / zbMATH Keywords: crack growth / rank | |||
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fracture mechanics | |||
| Property / zbMATH Keywords: fracture mechanics / rank | |||
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stress intensity factor | |||
| Property / zbMATH Keywords: stress intensity factor / rank | |||
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Revision as of 10:50, 28 June 2023
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction |
scientific article |
Statements
Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (English)
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20 August 2013
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smart-cut technology
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silicon-on-insulator wafer
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crack growth
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fracture mechanics
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stress intensity factor
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