Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (Q416551): Difference between revisions
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| Property / Mathematics Subject Classification ID: 76M20 / rank | |||
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| Property / Mathematics Subject Classification ID: 76D45 / rank | |||
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Revision as of 19:44, 29 June 2023
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging |
scientific article |
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Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (English)
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10 May 2012
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