Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging (Q1566558)

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Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
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    Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging (English)
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    26 November 2000
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    flow
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    conjugate heat transfer
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    microchannel-based heat sink
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    electronic packaging
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    incompressible laminar Navier-Stokes equations
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    thermal resistance
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    friction coefficient
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    Reynolds numbers
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    temperature and heat flux distributions
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    average heat transfer characteristics
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    convection-conduction
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