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- purpose Maxwell solver for the extraction of equivalent circuits of electronic package components for circuit simulation 1993-08-08 Paper...10 bytes (18 words) - 02:12, 28 December 2023
- purpose Maxwell solver for the extraction of equivalent circuits of electronic package components for circuit simulation 1993-08-08 Paper...10 bytes (18 words) - 02:12, 28 December 2023
- element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources 2022-12-21 Paper Penalized spline estimation...10 bytes (16 words) - 02:35, 11 December 2023
- Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging 2000-11-26 Paper Turbulent natural convection heat transfer in an...10 bytes (18 words) - 14:44, 13 December 2023
- Design-of-experiment methods for computational parametric studies in electronic packaging 1999-01-12 Paper Management of design activities in a concurrent...10 bytes (19 words) - 22:08, 12 December 2023
- element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources 2022-12-21 Paper Analysis of 2D heat...10 bytes (16 words) - 17:40, 24 September 2023
- Design-of-experiment methods for computational parametric studies in electronic packaging 1999-01-12 Paper...10 bytes (16 words) - 13:33, 24 September 2023
- Publication Type Applications of FEM for multiple laminated structure in electronic packaging 1999-01-12 Paper A procedure to obtain a fully stressed shape of...10 bytes (16 words) - 13:33, 24 September 2023
- Publication Date of Publication Type Thermal analysis of electronic packaging structure using isogeometric boundary element method 2021-07-14 Paper...10 bytes (16 words) - 23:24, 24 September 2023
- Publication Date of Publication Type Thermal analysis of electronic packaging structure using isogeometric boundary element method 2021-07-14 Paper...10 bytes (16 words) - 23:24, 24 September 2023
- computational fluid dynamics simulation tools for thermal characterization of electronic packages 2006-10-20 Paper...10 bytes (16 words) - 12:37, 14 March 2024
- computational fluid dynamics simulation tools for thermal characterization of electronic packages 2006-10-20 Paper...10 bytes (16 words) - 12:37, 14 March 2024
- induced damage 2004-07-12 Paper Failure modes and FEM analysis of power electronic packaging 2002-03-03 Paper...10 bytes (16 words) - 09:24, 25 September 2023
- induced damage 2004-07-12 Paper Failure modes and FEM analysis of power electronic packaging 2002-03-03 Paper https://portal.mardi4nfdi.de/entity/Q2705690 2001-05-21...10 bytes (16 words) - 09:24, 25 September 2023
- purpose Maxwell solver for the extraction of equivalent circuits of electronic package components for circuit simulation 1993-08-08 Paper Finite element...10 bytes (16 words) - 18:20, 21 September 2023
- induced damage 2004-07-12 Paper Failure modes and FEM analysis of power electronic packaging 2002-03-03 Paper Closed form vs. finite element analysis of laminated...10 bytes (16 words) - 09:24, 25 September 2023
- 2001-10-18 Paper Applications of FEM for multiple laminated structure in electronic packaging 1999-01-12 Paper Three-dimensional shape optimization using the boundary...10 bytes (16 words) - 13:33, 24 September 2023
- Design-of-experiment methods for computational parametric studies in electronic packaging 1999-01-12 Paper Boolean operations, Borel sets, and Hausdorff's...10 bytes (16 words) - 02:04, 7 October 2023
- Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging 2000-11-26 Paper Turbulent natural convection heat transfer in an...10 bytes (16 words) - 05:49, 12 December 2023
- element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources 2022-12-21 Paper Isogeometric FE-BE method...10 bytes (16 words) - 00:07, 25 September 2023
