Thermal Stresses in an Anisotropic Plate Disturbed by an Insulated Elliptic Hole or Crack

DOI10.1115/1.2897661zbMath0735.73005OpenAlexW2146212215MaRDI QIDQ3985840

Chyanbin Hwu

Publication date: 27 June 1992

Published in: Journal of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1115/1.2897661

zbMATH Keywords

identitiesstress intensity factorseigenvaluesstrain energy release rateeigenvectorsheat conductivitygeneral solutionscrack opening displacementStroh formalismheat flowelliptic holedegenerate materialshoop stresseffect of geometryelastic and thermal anisotropyplane anisotropic thermoelasticity

Mathematics Subject Classification ID

Anisotropy in solid mechanics (74E10) Stress concentrations, singularities in solid mechanics (74G70) Thermodynamics in solid mechanics (74A15) Fracture and damage (74R99)

Related Items

Thermoelastic in-plane fields in a linear anisotropic solid, Analytical solution for a reinforcement layer bonded to an elliptic hole under a remote uniform load, Thermoelasticity analysis of finite composite laminates weakened by multiple elliptical holes, Thermoelastic analysis of a two-dimensional decagonal quasicrystal with a conductive elliptic hole, Transformed function representations of plane solutions for anisotropic elasticity and thermoelasticity, Exact solution for an interface crack between dissimilar anisotropic thermoelastic solids under uniform heat flow, Effects of the moving speed of a rigid stamp on contact behaviors of anisotropic materials based on real fundamental solutions, Hypersingular integral equations for a thermoelastic problem of multiple planar cracks in an anisotropic medium, Some explicit expressions of Stroh-like formalism for coupled stretching-bending analysis, Two-phase potentials in anisotropic elasticity: antiplane deformation, Thermally conductive elliptic inhomogeneities in 2D anisotropic solids