Mode III crack problems of two bonded functionally graded strips with internal cracks

DOI10.1016/J.IJSOLSTR.2008.08.031zbMath1168.74430OpenAlexW1987153789MaRDI QIDQ834422

Yen-Ji Chen, Ching-Hwei Chue

Publication date: 26 August 2009

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2008.08.031

zbMATH Keywords

functionally graded materialstress intensity factorsingular integral equationGauss-Chebyshev technique

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70)

Related Items (2)

Mode III fracture problem of two arbitrarily oriented cracks located within two bonded functionally graded material strips ⋮ Anti-plane crack problem of a functionally graded piezoelectric materials strip with arbitrarily distributed properties

Cites Work

• Unnamed Item
• The general problem for an arbitrarily oriented crack in a FGM layer
• Thermal stress intensity factors for a crack in a strip of a functionally gradient material
• Bonded dissimilar strips with a crack perpendicular to the functionally graded interface
• Anti-plane fracture of a functionally graded material strip
• Propagation of an anti-plane moving crack in a functionally graded piezoelectric strip
• Mode I crack problem for a functionally graded orthotropic strip
• Anti-plane analysis of a functionally graded strip with multiple cracks
• The Crack Problem for Bonded Nonhomogeneous Materials Under Antiplane Shear Loading
• The Mode III Crack Problem in Bonded Materials With a Nonhomogeneous Interfacial Zone
• The Surface Crack Problem for a Plate With Functionally Graded Properties

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