Mixed-mode stress intensity factors of 3D interface crack in fully coupled electromagnetothermoelastic multiphase composites

DOI10.1016/J.IJSOLSTR.2009.02.010zbMath1167.74436OpenAlexW1995958474MaRDI QIDQ837803

Yaolin Shi, Yongbin Li, Bojing Zhu, Shaohua Yu, Tai-Yan Qin, Michael C. Sukop

Publication date: 21 August 2009

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2009.02.010

zbMATH Keywords

boundary element method3D interface crackextended stress intensity factorsfully coupled electromagnetothermoelastic anisotropic multiphase compositeshypersingular intergro-differential equation method

Mathematics Subject Classification ID

Brittle fracture (74R10) Boundary element methods applied to problems in solid mechanics (74S15) Stress concentrations, singularities in solid mechanics (74G70) Composite and mixture properties (74E30) Electromagnetic effects in solid mechanics (74F15)

Related Items (5)

Fatigue crack growth simulations of interfacial cracks in bi-layered fgms using XFEM ⋮ An electrically impermeable and magnetically permeable interface crack with a contact zone in a magnetoelectroelastic bimaterial under uniform magnetoelectromechanical loads ⋮ A set of collinear electrically charged interfacial cracks in magnetoelectroelastic bimaterial ⋮ Dynamic stress intensity factors of two 3D rectangular cracks in a transversely isotropic elastic material under a time-harmonic elastic P-wave ⋮ Exact solution for elliptical inclusion in magnetoelectroelastic materials

Cites Work

• Unnamed Item
• The deformation of the front of a 3D interface crack propagating quasistatically in a medium with random fracture properties
• Interaction between a screw dislocation and a viscoelastic piezoelectric bimaterial interface
• Controlling parameter of the stress intensity factors for a planar interfacial crack in three-dimensional bimaterials
• The use of conservative integral in bi-material interface crack problems subjected to thermal loads
• 3D modeling of crack growth in electro-magneto-thermo-elastic coupled viscoplastic multiphase composites
• Antiplane crack at the interface of two bonded dissimilar graded piezoelectric materials
• Analysis method of planar interface cracks of arbitrary shape in three-dimensional transversely isotropic magnetoelectroelastic bimaterials
• Applications of finite-part integrals to the singular integral equations of crack problems in plane and three-dimensional elasticity
• Stress intensity factors of a rectangular crack meeting a bimaterial interface.
• Finite-part integral and boundary element method to solve three-dimensional crack problems in piezoelectric materials
• Application of hypersingular integral equation method to three-dimensional crack in electromagnetothermoelastic multiphase composites
• On the static nonlinear theory of electromagnetic thermoelastic solids. I, II
• Mixed‐mode stress intensity factors of a three‐dimensional crack in a bonded bimaterial

This page was built for publication: Mixed-mode stress intensity factors of 3D interface crack in fully coupled electromagnetothermoelastic multiphase composites