A numerical model of stress driven grain boundary diffusion.

DOI10.1016/J.JCP.2003.08.015zbMath1117.74302OpenAlexW2041492825MaRDI QIDQ1418699

Jon Wilkening, James A. Sethian

Publication date: 14 January 2004

Published in: Journal of Computational Physics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.jcp.2003.08.015

zbMATH Keywords

ElasticityFinite elementmethodCorner singularityElectromigrationGrain boundary

Mathematics Subject Classification ID

Groups and semigroups of linear operators (47D03) Coupling of solid mechanics with other effects (74F99)

Related Items (7)

The instability of Wilton ripples ⋮ Corner singularities for elliptic problems: Integral equations, graded meshes, quadrature, and compressed inverse preconditioning ⋮ Adaptively weighted least squares finite element methods for partial differential equations with singularities ⋮ On the evaluation of layer potentials close to their sources ⋮ Recoverable creep deformation and transient local stress concentration due to heterogeneous grain-boundary diffusion and sliding in polycrystalline solids ⋮ Integral equation methods for elliptic problems with boundary conditions of mixed type ⋮ Elastostatic computations on aggregates of grains with sharp interfaces, corners, and triple-junctions

Uses Software

• COLAMD

Cites Work

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• Two classes of mixed finite element methods
• A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid
• First-Order System Least Squares for Second-Order Partial Differential Equations: Part II
• First-Order System Least Squares for the Stokes Equations, with Application to Linear Elasticity
• Arbitrary branched and intersecting cracks with the extended finite element method
• Analysis of Stress-Driven Grain Boundary Diffusion. Part I
• Interpolation zwischen den Klassen 𝔖_p von Operatoren in Hilberträumen
• Fast semi-analytic computation of elastic edge singularities
• Computation for electromigration in interconnects of microelectronic devices

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