Thermal stress analysis of current-carrying media containing an inclusion with arbitrarily-given shape

DOI10.1016/j.apm.2019.11.002zbMath1481.74145OpenAlexW2988637447MaRDI QIDQ2174388

Shuang Wang, Chuanbin Yu, Cun-Fa Gao, Zeng-Tao Chen

Publication date: 21 April 2020

Published in: Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.apm.2019.11.002

zbMATH Keywords

thermal stresscomplex variableelectric currentinclusion

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Electromagnetic theory (general) (78A25)

Related Items (2)

On the three-dimensional singular stress field near the corner front of revolution-shaped inclusions ⋮ A modified Laurent series for hole/inclusion problems in plane elasticity

Cites Work

• Unnamed Item
• Magneto-elastic stress induced by an electric current in an infinite thin plate with an elliptical hole
• Determination of effective thermal expansion coefficients of unidirectional fibrous nanocomposites
• Inclusions of arbitrary shape in magnetoelectroelastic composite materials
• Heat conduction and thermal stress induced by an electric current in an infinite thin plate containing an elliptical hole with an edge crack
• Analytic solutions for the problems of an inclusion of arbitrary shape embedded in a half-plane.
• Thermoelectric fields and associated thermal stresses for an inclined elliptic hole in thermoelectric materials
• An arc-shaped crack in nonlinear fully coupled thermoelectric materials
• Thermal stress analysis in metallic plates with a non-circular hole subjected to uniform heat flux
• Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method
• Faber series method for two-dimensional problems of an arbitrarily shaped inclusion in piezoelectric materials
• Surface tension-induced stress concentration around a nanosized hole of arbitrary shape in an elastic half-plane
• Closed-form solution for a circular nano-inhomogeneity with interface effects in an elastic plane under uniform remote heat flux
• A solution of the elliptic piezoelectric inclusion problem under uniform heat flux
• Interfacial thermal stress analysis of an elliptic inclusion with a compliant interphase layer in plane elasticity

This page was built for publication: Thermal stress analysis of current-carrying media containing an inclusion with arbitrarily-given shape