Staging Problem of a Dual Delivery Pick-and-Place Machine in Printed Circuit Card Assembly

DOI10.1287/opre.42.1.81zbMath0798.90073OpenAlexW1978649510MaRDI QIDQ4287601

Panagiotis Kouvelis, Reza H. Ahmadi

Publication date: 12 April 1994

Published in: Operations Research (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1287/opre.42.1.81

zbMATH Keywords

assembly of printed circuit boardsmaterial staging

Mathematics Subject Classification ID

Applications of mathematical programming (90C90) Integer programming (90C10) Production models (90B30)

Related Items (10)

Heuristic approaches for batching jobs in printed circuit board assembly ⋮ Workload planning in small lot printed circuit board assembly ⋮ Design of electronic assembly lines: An analytical framework and its application ⋮ Process planning for circuit card assembly on a series of dual head placement machines ⋮ Scheduling a pick and place packaging line ⋮ A model to optimize placement operations on dual-head placement machines ⋮ A taboo search heuristic for the optimisation of a multistage component placement system ⋮ Enabling flexibility on a dual head placement machine by optimizing platform-tray-feeder picking operations ⋮ The assembly of printed circuit boards: A case with multiple machines and multiple board types ⋮ Optimization of printed circuit board manufacturing: Integrated modeling and algorithms

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