Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (Q416551)
From MaRDI portal
 | This is the item page for this Wikibase entity, intended for internal use and editing purposes. Please use this page instead for the normal view: Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging |
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging |
scientific article |
Statements
Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (English)
0 references
10 May 2012
0 references
