Pages that link to "Item:Q2511664"
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The following pages link to Solution of problem of two dissimilar materials bonded at one interface subjected to temperature (Q2511664):
Displaying 3 items.
- Stress intensity factors for bonded two half planes weakened by thermally insulated cracks (Q828231) (← links)
- Solution of bonded bimaterial problem of two interfaces subjected to concentrated forces and couples (Q2803455) (← links)
- Debonding fracture of bonded bimaterial semi‐strips subjected to concentrated forces and couples (Q6065024) (← links)
