Pages that link to "Item:Q373408"
From MaRDI portal
The following pages link to Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique (Q373408):
Displaying 3 items.
- Analysis of fatigue delamination growth in flip-chip package (Q478321) (← links)
- Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings (Q2223897) (← links)
- Elastic interaction of interfacial spherical-cap cracks in hollow particle filled composites (Q2428362) (← links)