Pages that link to "Item:Q598097"
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The following pages link to Thermal stresses around a crack in the nonhomogeneous interfacial layer between two dissimilar elastic half-planes (Q598097):
Displaying 8 items.
- Edge-cracked bimaterial systems under thermal heating (Q546634) (← links)
- Thermal stresses around two parallel cracks in two bonded dissimilar elastic half-planes (Q687440) (← links)
- Anisotropic heat conduction across an interface crack/defect filled with a thin interstitial medium (Q973358) (← links)
- Dynamic stress intensity factors for two parallel interface cracks between a nonhomogeneous bonding layer and two dissimilar elastic half-planes subject to an impact load (Q994745) (← links)
- Thermoelastic analysis of a partially insulated crack in a strip under thermal impact loading using the hyperbolic heat conduction theory (Q1659811) (← links)
- Modeling method for the crack problem of a functionally graded interfacial zone with arbitrary material properties (Q2392836) (← links)
- Thermoelastic problem of steady-state heat flows disturbed by a crack at an arbitrary angle to the graded interfacial zone in bonded materials (Q2428324) (← links)
- Inertia effect analysis of a half‐plane with an induced crack under thermal loading using hyperbolic heat conduction (Q6065036) (← links)
