A concurrent atomistic and continuum coupling method with applications to thermo-mechanical problems
From MaRDI portal
Recommendations
- Concurrent coupling of atomistic and continuum models at finite temperature
- Concurrent atomistic/continuum simulation of thermo-mechanical coupling phenomena
- An atomistic-to-continuum coupling method for heat transfer in solids
- Coupling of atomistic and continuum simulations using a bridging scale decomposition.
- A three-layer-mesh bridging domain for coupled atomistic-continuum simulations at finite temperature: formulation and testing
Cites work
- A bridging domain method for coupling continua with molecular dynamics
- A dynamic atomistic--continuum method for the simulation of crystalline materials
- A phonon heat bath approach for the atomistic and multiscale simulation of solids
- A temperature equation for coupled atomistic/continuum simulations
- A variational approach to coarse graining of equilibrium and non-equilibrium atomistic description at finite temperature
- An atomistic-to-continuum coupling method for heat transfer in solids
- An introduction and tutorial on multiple-scale analysis in solids
- An introduction to computational nanomechanics and materials
- Computational Contact Mechanics
- Concurrent AtC coupling based on a blend of the continuum stress and the atomistic force
- Concurrent coupling of atomistic and continuum models at finite temperature
- Conservation properties of the bridging domain method for coupled molecular/continuum dynamics
- Coupling of atomistic and continuum simulations using a bridging scale decomposition.
- Estimates for the Hardy–Littlewood maximal function on the Heisenberg group
- Heterogeneous multiscale methods: a review
- scientific article; zbMATH DE number 5719287 (Why is no real title available?)
- scientific article; zbMATH DE number 1998245 (Why is no real title available?)
- Modelling transient heat conduction in solids at multiple length and time scales: a coupled non-equilibrium molecular dynamics/continuum approach
- Molecular dynamics calculation of heat dissipation during sliding friction.
- Numerical recipes. The art of scientific computing.
- Sliding of rough surfaces and energy dissipation with a 3D multiscale approach
- Spatial filters for bridging molecular dynamics with finite elements at finite temperatures
- Towards an atomistic understanding of solid friction by computer simulations
Cited in
(16)- An atomistic-to-continuum coupling method for heat transfer in solids
- Challenges in atomistic-to-continuum coupling
- Adaptive spacetime method using Riemann jump conditions for coupled atomistic-continuum dynamics
- Combining dual domain material point method with molecular dynamics for thermodynamic nonequilibriums
- Mechanical modeling of graphene using the three-layer-mesh bridging domain method
- A concurrent multiscale method based on smoothed molecular dynamics for large-scale parallel computation at finite temperature
- Selective damping method for the weak-Arlequin coupling of molecular dynamics and finite element method
- Concurrent Coupling of Atomistic and Continuum Models
- Concurrent atomistic/continuum simulation of thermo-mechanical coupling phenomena
- An embedded statistical method for coupling molecular dynamics and finite element analyses
- Spatial filters for bridging molecular dynamics with finite elements at finite temperatures
- On the Cauchy—Born Rule
- Concurrent coupling of atomistic and continuum models at finite temperature
- A temperature equation for coupled atomistic/continuum simulations
- Modelling transient heat conduction in solids at multiple length and time scales: a coupled non-equilibrium molecular dynamics/continuum approach
- A three-layer-mesh bridging domain for coupled atomistic-continuum simulations at finite temperature: formulation and testing
This page was built for publication: A concurrent atomistic and continuum coupling method with applications to thermo-mechanical problems
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2952428)
