Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer
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DOI10.5281/zenodo.14707886Zenodo14707886MaRDI QIDQ6710817FDOQ6710817
Dataset published at Zenodo repository.
Achintya Paradkar, Fabian Resare, Karim Dakroury, Witlef Wieczorek, Paul Nicaise
Publication date: 20 January 2025
Copyright license: Creative Commons Attribution 4.0 International
Data used for figures in "Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under bump metallization layer" by A. Paradkar et al. Appl. Phys. Lett.126, 022601 (2025)
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