Diffusive shrinkage of a void within a grain of a stressed polycrystal.

DOI10.1016/S0022-5096(02)00039-XMaRDI QIDQ1415907zbMATH OpenOpenAlexFDO

Authors Hua Wang, Z. Li

Publication date 9 December 2003

Published in Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0022-5096(02)00039-x

zbMATH Keywords

Chemical potentialElastic energyLattice diffusionsurface energy

Mathematics Subject Classification ID

Crystalline structure (74E15)

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Cites work

• An axisymmetric model of pore-grain boundary separation

Cited in

(6)

• Pore migration under high temperature and stress gradients
• Void growth due to creep and grain boundary diffusion at high triaxialities
• The voids kinetics during diffusion process
• The stress intensity factor of an edge dislocation near an elliptically blunted crack tip
• Effects of electric and mechanical loads on the morphological evolution of a void in piezoelectric films
• A model of diffusion annihilation of gas-filled spherical pores during hot isostatic pressing

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