Finite element modeling of a microelectronic structure under uniform thermal loading.

DOI10.1016/S0168-874X(01)00077-4MaRDI QIDQ5958742zbMATH OpenOpenAlexFDO

Authors A. F. Okyar, M. Gosz

Publication date 3 March 2002

Published in Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0168-874x(01)00077-4

Mathematics Subject Classification ID

Thermodynamics in solid mechanics (74A15) Analysis of microstructure in solids (74N15) Finite element methods applied to problems in solid mechanics (74S05)

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Cited in

(12)

• Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model
• Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages
• Applications of FEM for multiple laminated structure in electronic packaging
• Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies
• Finite element model analysis of thermal failure in connector
• Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models
• Improved tri-layered interfacial stress model with the effect of different temperatures in the layers
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• Multiphysics computation of thermomechanical fatigue in electronics under electrical loading
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• Analysis of interfacial thermal stresses of chip-substrate structure
• 3-D finite element simulation of wafer thermal distortion and stress fields in exposure process

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