Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains (Q1290005)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains |
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Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains (English)
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2 July 2000
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