Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (Q1401103)
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scientific article; zbMATH DE number 1965125
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| English | Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging |
scientific article; zbMATH DE number 1965125 |
Statements
Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (English)
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17 August 2003
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Solder joint
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Lead-tin alloy
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Reflow process
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Solidification
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Electronic packaging
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0.7482240200042725
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0.6761325001716614
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0.6749547123908997
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0.6741867065429688
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0.6737034320831299
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