Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (Q1401103)
From MaRDI portal
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging |
scientific article |
Statements
Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (English)
0 references
17 August 2003
0 references
Solder joint
0 references
Lead-tin alloy
0 references
Reflow process
0 references
Solidification
0 references
Electronic packaging
0 references
