A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (Q2191601)
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scientific article; zbMATH DE number 7214848
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| English | A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging |
scientific article; zbMATH DE number 7214848 |
Statements
A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (English)
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25 June 2020
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boundary element method
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elastic contact problem
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thermoelastic contact
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microelectronic packaging
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variable thermal contact resistance
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0.8037646412849426
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0.7510982751846313
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