On coupling contact analysis of thermoelectric materials (Q2245837)
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scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | On coupling contact analysis of thermoelectric materials |
scientific article |
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On coupling contact analysis of thermoelectric materials (English)
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15 November 2021
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Seebeck effect
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punch
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closed-form solution
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surface contact stress
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intensity factors
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