Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces (Q2385836)

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Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
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    Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces (English)
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    15 October 2007
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    Electromigration
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    interconnect failure
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    damage mechanics
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    void growth
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    interfaces and surfaces
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    diffusion
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    thermodynamics
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