Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces (Q2385836)
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English | Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces |
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Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces (English)
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15 October 2007
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Electromigration
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interconnect failure
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damage mechanics
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void growth
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interfaces and surfaces
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diffusion
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thermodynamics
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