An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction (Q2511583)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction |
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An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction (English)
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6 August 2014
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adhesively bonded joints
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stress analysis
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full layerwise theory
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analytical solution
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heat conduction
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