Predicted stresses in die-carrier assemblies in ``stretchable'' electronics: is there an incentive for using a compliant bond? (Q3076990)
From MaRDI portal
!
This is the item page for this Wikibase entity, intended for internal use and editing purposes. Please use the normal view instead:
scientific article; zbMATH DE number 5853954
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | No label defined |
||
| English | Predicted stresses in die-carrier assemblies in ``stretchable'' electronics: is there an incentive for using a compliant bond? |
scientific article; zbMATH DE number 5853954 |
Statements
Predicted stresses in die-carrier assemblies in “stretchable” electronics: is there an incentive for using a compliant bond? (English)
0 references
21 February 2011
0 references
stretchable electronics
0 references
die-carrier assembly
0 references
stresses
0 references
0.7295136451721191
0 references
0.6917985081672668
0 references
0.6684709787368774
0 references
0.6594395041465759
0 references
