Three-dimensional simulation of underfill process in flip-chip encapsulation (Q365295)
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scientific article; zbMATH DE number 6204768
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | No label defined |
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| English | Three-dimensional simulation of underfill process in flip-chip encapsulation |
scientific article; zbMATH DE number 6204768 |
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Three-dimensional simulation of underfill process in flip-chip encapsulation (English)
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4 September 2013
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underfill
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capillary action
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fluid flow
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simulation
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three-dimensional
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0.8766806721687317
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0.8407543301582336
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0.7534798383712769
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0.7498335242271423
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