Dépôt électrolytique épais: Modification du profil de la pièce à revêtir (Q4954020)
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scientific article; zbMATH DE number 1448554
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | No label defined |
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| English | Dépôt électrolytique épais: Modification du profil de la pièce à revêtir |
scientific article; zbMATH DE number 1448554 |
Statements
Dépôt électrolytique épais: Modification du profil de la pièce à revêtir (English)
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19 June 2001
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electromechanical plating
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depositing thickness
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polarisation laws
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electrode growth
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boundary element method
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0.8731686
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0.86613286
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0.85568637
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0.85261524
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0.85235584
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