Analyses of crack growth along interface of patterned wafer-level cu-cu bonds (Q837885)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Analyses of crack growth along interface of patterned wafer-level cu-cu bonds |
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Analyses of crack growth along interface of patterned wafer-level cu-cu bonds (English)
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21 August 2009
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interface toughness
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plasticity
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crack growth
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finite strains
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thin films
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