Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method (Q936378)
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scientific article; zbMATH DE number 5311359
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| English | Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method |
scientific article; zbMATH DE number 5311359 |
Statements
Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method (English)
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13 August 2008
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0.8081864714622498
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0.7557030916213989
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0.7424125075340271
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0.7299763560295105
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