Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies
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Cites work
- Closed-form correlations for thermal optimization of microchannels
- Comparative analysis of jet impingement and microchannel cooling for high heat flux applications
- Convection heat transfer from tube banks in crossflow: analytical approach
- Forced convective heat transfer across a pin fin micro heat sink
- Optimization of micro heat exchanger: CFD, analytical approach and multi-objective evolutionary algorithms
- Optimum jet-to-jet spacing of heat transfer for staggered arrays of impinging air jets
- Three-dimensional numerical optimization of a manifold microchannel heat sink
Cited in
(7)- Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method
- Thermal management of high power electronics with phase change cooling
- Optimization of thermo-electric coolers using hybrid genetic algorithm and simulated annealing
- Multi-objective optimization of a rotating cooling channel with staggered pin-fins for heat transfer augmentation
- Multidisciplinary optimization of a pin-fin radial heat sink for LED lighting applications
- A pseudo 3D cooling heat sink model designed by multi-objective topology optimization method
- Optimization of heat sink mass using the DYNAMIC-Q numerical optimization method
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