| Publication | Date of Publication | Type |
|---|
Avoiding inelastic strains in solder joint interconnections of space electronics
ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik | 2024-03-26 | Paper |
Dynamic response of electronic materials to impact loading: review
ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik | 2023-12-13 | Paper |
Aerospace electronics reliability prediction: application of two advanced probabilistic techniques
ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik | 2023-12-12 | Paper |
Bending of a bi-material cantilever beam, with consideration of the role of the interfacial shearing stress
ZAMM. Zeitschrift für Angewandte Mathematik und Mechanik | 2012-08-27 | Paper |
Analysis of a bi-material strip
ZAMM. Zeitschrift für Angewandte Mathematik und Mechanik | 2012-05-11 | Paper |
Analysis of a pre-stressed bi-material accelerated-life-test (ALT) specimen
ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik | 2011-05-31 | Paper |
Analysis of an elongated stretched strip, with application to a strain‐gage electrical sensor design
ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik | 2011-04-15 | Paper |
Predicted stresses in die-carrier assemblies in ``stretchable electronics: is there an incentive for using a compliant bond?
ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik | 2011-02-21 | Paper |
Approximate evaluation of the interfacial shearing stress in cylindrical double lap shear joints with application to dual-coated optical fibers
International Journal of Solids and Structures | 2000-09-05 | Paper |
Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains
International Journal of Solids and Structures | 2000-07-02 | Paper |
Adhesively bonded assemblies with identical nondeformable adeherends and `piecewise continuous' adhesive layer: Predicted thermal stresses in the adhesive
International Journal of Solids and Structures | 2000-01-01 | Paper |
Shock-excited vibrations of a conservative duffing oscillator with application to shock protection in portable electronics
International Journal of Solids and Structures | 1999-11-08 | Paper |
Predicted Thermal Mismatch Stresses in a Cylindrical Bi-material Assembly Adhesively Bonded at Its Ends
Journal of Applied Mechanics | 1999-03-09 | Paper |
Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to its Support Contour
Journal of Applied Mechanics | 1993-01-17 | Paper |
Nonlinear dynamic response of a flexible thin plate to constant acceleration applied to its support contour, with application to printed circuit boards, used in avionic packaging
International Journal of Solids and Structures | 1993-01-16 | Paper |
Thermally Induced Interfacial Stresses in Elongated Bimaterial Plates
Applied Mechanics Reviews | 1993-01-16 | Paper |
Interfacial Stresses in Bimetal Thermostats
Journal of Applied Mechanics | 1989-01-01 | Paper |
An Approximate Analysis of Stresses in Multilayered Elastic Thin Films
Journal of Applied Mechanics | 1988-01-01 | Paper |
