Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components
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Publication:1001042
DOI10.1016/j.ijheatmasstransfer.2008.04.071zbMath1153.80336MaRDI QIDQ1001042
Publication date: 12 February 2009
Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2008.04.071
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