Homogenization of delamination growth in an ACA flip-chip joint based on micropolar theory

DOI10.1016/J.EUROMECHSOL.2008.10.001MaRDI QIDQ1012260zbMATH OpenOpenAlexFDO

Authors Yan Zhang, Ragnar Larsson

Publication date 15 April 2009

Published in European Journal of Mechanics. A. Solids (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.euromechsol.2008.10.001

zbMATH Keywords

cohesive zonedelaminationhomogenizationinterface modelingmicropolar theorymicrosystem

Mathematics Subject Classification ID

Homogenization in equilibrium problems of solid mechanics (74Q05) Effective constitutive equations in solid mechanics (74Q15) Fracture and damage (74R99)

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Cites work

• \(FE^2\) multiscale approach for modelling the elastoviscoplastic behaviour of long fibre SiC/Ti composite materials
• A second-order homogenization procedure for multi-scale analysis based on micropolar kinematics
• A thermodynamically consistent theory of gradient-regularized plasticity coupled to damage
• Computational homogenization analysis in finite plasticity. Simulation of texture development in polycrystalline materials
• Elastic crack growth in finite elements with minimal remeshing
• Elastic properties of reinforced solids: Some theoretical principles
• Homogenization of microsystem interconnects based on micropolar theory and discontinuous kinematics
• scientific article; zbMATH DE number 3887184 (Why is no real title available?)
• Multi‐scale constitutive modelling of heterogeneous materials with a gradient‐enhanced computational homogenization scheme
• Theory and numerics for finite deformation fracture modelling using strong discontinuities
• Theory and numerics of ductile micropolar elastoplastic damage

Cited in

(2)

• Homogenization of microsystem interconnects based on micropolar theory and discontinuous kinematics
• Analysis of fatigue delamination growth in flip-chip package

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