Thermal-mechanical interface crack behaviour of a surface mount solder joint
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Publication:1274159
DOI10.1016/S0168-874X(98)00028-6zbMath0921.73250OpenAlexW2072043004MaRDI QIDQ1274159
C. M. L. Wu, J. K. L. Lai, Yong-li Wu
Publication date: 12 January 1999
Published in: Finite Elements in Analysis and Design (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0168-874x(98)00028-6
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